Micron plans to invest around $7 billion over the next five years to boost memory chip production in Singapore. The company announced the investment on the same day it broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility in the city-state.

Micron Technology is investing $7 billion to build an advanced chip packaging facility in Singapore as the semiconductor giant expands its capacity to cater to booming demand for AI chips.

It's Singapore's first facility dealing with HBM, part of the AI chips that's powering companies like Nvidia and TSMC to new heights.

The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

Singapore is set to solidify its position in the global semiconductor supply chain with Micron Technology’s announcement of a $7 billion investment in a high-bandwidth memory (HBM) packaging facility.

Set to start operating in 2026, the plant will be used to package high-bandwidth memory chips, a type widely seen in AI data centres.

Singapore can be expected to play a larger role in developing complex artificial intelligence (AI) applications when Micron's new $9.5 billion high bandwidth memory (HBM) advanced packaging facility in Woodlands becomes operational in 2026.

Micron Technology has started constructing its multi-billion-dollar packaging facility for high-bandwidth memory (HBM) in Singapore. The company will invest $7 billion in the plant, as it expects demand for HBM3E,