Abstract: Wafer sawing is one of the back-end technologies of advanced packaging. Higher quality and narrower saw street can improve the density of die in one wafer, thus reduce the wafer cost. In ...
5d
CPChem's NanoSlide(TM) Drilling Fluid Sets New Standard for Lubrication with Multiphase Technology
Drilling Specialties, in collaboration with Chevron Phillips Chemical's polyalphaolefins organization, announced today the launch of NanoSlide(TM) drilling fluid lubricant, a proprietary ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback