Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.
Nvidia has partnered with TSMC for the development of silicon photonics. Speaking to reporters after meeting with TSMC chairman C.C. Wei in Taiwan, Nvidia CEO Jensen Huang said that the partnership ...
Semiconductor stocks are getting hit with a wave of bearish pressures following news that the U.S. will take new steps to ...
NVIDIA CEO Jensen Huang says his company is working with TSMC to create new opportunities in robotics and autonomous vehicles ...
TSMC CEO C.C. Wei has dismissed recent market speculation indicating Nvidia is cutting back its demand for ...
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) and US-based artificial intelligence (AI) chip designer Nvidia Corp have ...
NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition ...
Nvidia CEO Jensen Huang confirms changes in advanced packaging needs at TSMC, opting for CoWoS-L over CoWoS-S for upcoming ...
Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S.
TSMC, which makes chips for Nvidia, reported net income of $11.6 billion. Its CFO said this was supported by "strong demand" ...
Taiwan Semiconductor Manufacturing (NYSE:TSM) on Thursday said it expects products for artificial intelligence (AI) ...
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