The advancement of the semiconductor industry hinges on the ability of IC manufacturers to continue offering more performance and functionality for the money. As mainstream CMOS processes reach their ...

The global semiconductor industry may be entering a fundamentally different growth cycle as artificial intelligence drives unprecedented demand for computing, memory, advanced packaging and ...

GlobalFoundries is probably doing something right because China has set its eyes on GlobalFoundries with rumors of a possible imminent acquisition. Indeed, thanks to several strategical decisions, ...

This interview features Mr. Kazushige Koshika, President of TOPPAN Technical Design Center Inc. Tell me a bit about your background? How did you first get started with TOPPAN Technical Design Center ...

GlobalFoundries (Nasdaq: GFS)(GF) and RAAAM Memory Technologies, a pioneer in advanced on-chip memory solutions, today ...

In a world where computing power is paramount, the architecture behind our devices often goes unnoticed. The Arm Cortex-A53 stands as a testament to the evolution of microprocessor design, merging ...

Power, performance and area (PPA) are three core competencies on which an ASIC design is evaluated. In an ideal world, ASIC designers strive to improve the performance of their design in a minimum ...

Wafer probe (or wafer probing) refers to the electrical testing of semiconductor dies while they are still part of the wafer. By using microscopic probe needles to contact bond pads or built-in test ...

Application Specific Integrated Circuit (ASIC) is a non-standard integrated circuit designed for a specific use or application. ASIC is usually designed for a product that will have a large production ...

65nm, 28nm, 10nm, 7nm… If you follow Intel’s processors or Xilinx’s FPGAs, you have probably heard about the term semiconductor process node. Semiconductor foundries are investing billions of dollars ...

Each semiconductor company reaches at some point to the manufacturing dilemma – how to go into production in the cheapest, most efficient and highest quality way? Is it using an external full turnkey ...

High-bandwidth memory (HBM) is a JEDEC-defined standard, dynamic random access memory (DRAM) technology that uses through-silicon vias (TSVs) to interconnect stacked DRAM die. In its first ...