Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful tape-out of the industry-leading Universal Chiplet Interconnect Express (UCIe) PHY Face-Up IP on TSMC's N5 process ...
MediaTek is using Intel's EMIB packaging alongside TSMC's CoWoS for AI ASIC designs, targeting 26% of the AI ASIC market by 2028 amid capacity constraints.
Advanced Micro Devices (NASDAQ:AMD) announced that it has started ramping production of its sixth-generation AMD EPYC processors, known by the codename “Venice,” using Taiwan Semiconductor ...
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