Global food product manufacturer Mars Inc. is partnering with Pittsburgh-based engineering software company Ansys in which Mars will adopt simulation software that could “reimagine” its packaging ...

The senior leadership team at Industrial Packaging has partnered with organizations like MassMEP to ensure its workforce is properly trained and operating efficiently. COURTESY Founded in Worcester in ...

GRAND RAPIDS, Mich., November 25, 2024--(BUSINESS WIRE)--UFP Packaging announced the opening of its 10,000-square-foot Packaging Design and Development Center (DDC) at its Newnan, Ga., facility. The ...

Moona shares two aspects of sustainability, the importance of learning the standards, and how “burnout” can actually be a ...

The American Packaging Corp. recently renewed its funding support to Rochester Institute of Technology and its packaging science program with a gift of $1 million. Funding from the long-time corporate ...

BALA CYNWYD, Pa.--(BUSINESS WIRE)--PaperWorks announces the opening of the new Packaging Development (PacDev) Design + Innovation Centre. Located on-site at the PaperWorks Kitchener, Ontario facility, ...

This concentration is designed to equip practitioners with the tools necessary to meet tomorrow’s challenges concerning packaging and its sustainability in the associated supply chains. To this end, ...

For many packaging firms, gone are the times when sustainability was just sliver of thought operating on the fringes of an overall larger operation. Companies and consumers alike are increasingly ...

Kellogg’s lead packaging engineer Shannon Moore shares an insider’s view of the development including key considerations, what was learned, advice and more. 1. It’s a breakthrough accomplishment.

Rebecca Oesterle saw the packaging industry growth first hand as one of Energizer’s earliest supply chain managers. Over her career, she led many changes in packaging—an industry that would become ...

ITC aims to make its packaging channel-agnostic as creating different packaging for each channel poses a challenging supply chain issue. However, not all products can utilize the same packaging for ...

The VTT Technical Research Centre of Finland has been awarded €29 million of EU Chips Act money for chip packaging development under the EU APECS (Advanced Packaging and Heterogeneous Integration for ...