The M61041FP is an semiconductor IC device developed for smart battery packs. It is ideal for smart battery system (SBS) battery packs that consist of four lithium ion batteries connected in series. A ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Nisshinbo Micro Devices Inc. has deployed multiple Cadence ® solutions, including the AI-based ...

On Jan. 3, Synaptics released the SYN4778, a small, low power, accurate GNSS integrated circuit for Internet of Things (IoT) devices. SYN4778 is designed to extend battery life, reduce product size, ...

Not so long ago, defense and aerospace applications were the traditional drivers of advances in electronic packaging technologies, or "the way electronic systems are assembled." At the time, cost was ...

Addressing the challenge of a GNSS receiver consuming a high percentage of available power in battery-based IoT devices, Synaptics Inc. unveiled its SYN4778, claimed as the smallest, lowest power, ...

3D ICs are an exciting and promising extension of heterogeneous advanced package technology into the third dimension. Although far from mainstream, 3D IC’s time is coming, as chiplet standardization ...

Chinese brand vendors releasing new handset models are providing support for related peripheral IC suppliers' sales in the fourth quarter of 2023, according to industry sources. Some subscribers ...

MEMS are primarily transducer systems that can control or sense chemical, optical, or physical quantities, such as fluids, acceleration, or radiation. A MEMS device/transducer possesses an electrical ...

Multiple touch points in manufacturing and packaging are exposing gaps in the data used to track different components, making it difficult to identify the source of issues that can affect yield and ...

Accurately estimating the junction temperature of a semiconductor device is essential for ensuring its reliability, performance, and longevity. Junction temperature has a direct influence on the ...