Genesis Photonics Inc. (GPI), which has been devoted to developing LED epitaxial wafer and chip technology for over 10 years, has made great strides in flip-chip packaging. GPI has developed MATCH LED ...

New York, NY, Aug. 08, 2023 (GLOBE NEWSWIRE) -- Zion Market Research has published a new research report titled “Flip Chip Bonder Market By Type (Fully Automatic And Semi-Automatic), By Application ...

SAN JOSE, Calif.--(BUSINESS WIRE)--TDK Corporation (TSE: 6762) will present the latest in load port and flip chip technology at Booth 1926 in the South Hall at the SEMICON West Conference 2019, July 9 ...

SEOUL, South Korea, Jan. 18, 2018 /PRNewswire/ -- LG Innotek today announced that it had succeeded in developing an 'advanced flip chip LED package' that demonstrates high efficiency and high luminous ...

Fujitsu Limited announced that it has developed new technology that enables formation of ultrafine pitch 35 micron (center-to-center distance of bumps) solder bumps (*1), and high-precision flip-chip ...

Flip-chip bonding is the process of bonding on-chip electrodes to printed circuit board (PCB) electrodes using Au bumps. The bond strength influences the circuit’s conductivity directly, without the ...

Harvatek Corporation has introduced a new LED product in chip scale package (CSP). This LED has high brightness with low power dissipation and there are no wire bonding which reduces the processing ...

Fine pitch copper (Cu) pillar bump adoption has been growing in high-performance and low-cost flip chip packages. Higher input/output (I/O) density and very fine pitch requirements are driving very ...

New bump structures are being developed to enable higher interconnect densities in flip-chip packaging, but they are complex, expensive, and increasingly difficult to manufacture. For products with ...