In what it called a “leap forward” in deep trench etch nanomanufacturing technology, semiconductor capital equipment giant Applied Materials Inc. today announced the debut of its Centura Mariana ...
Accurately characterizing high aspect ratio geometries—such as narrow gaps, deep trenches, and deep holes—is becoming increasingly important across a wide range of technologies and industries. To meet ...
Non-destructive and accurate characterization of high aspect ratio (HAR) and composite micro-trenches is essential for semiconductor inspection in fields like microelectromechanical systems (MEMS) and ...
In a leap forward for miniaturized electronics, researchers have unveiled a groundbreaking method to fabricate high-aspect-ratio 3D microstructures with sub-10 micron resolution—tackling one of the ...
Infineon Technologies and Nanya Technology have created a 70nm process technology for future 300mm DRAM production based on deep trench cells. The technology came out of joint development work by the ...
According to insights from Future Market Insights, the market was valued at USD 0.40 billion in 2025 and is expected to grow to USD 0.43 billion in 2026. With steady expansion at a CAGR of 8.80%, the ...
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