The first 2.5D and 3D chips are expected to arrive next year, with the mainstream chip market expected to follow in 2013. While this trend already has seen its share of hype, stacked die—whether ...

AMD has better detailed its next-gen 3D V-Cache stacking technology, where at the exciting but all-digital Hot Chips 33 symposium the company teased its current, and even future 3D stacking ...

Designers, who need to build high performance real-time sensing systems, are greatly challenged since every building block in the system needs to be built with a technology that allows that building ...

Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...

Hybrid, 3D integrated optical transceiver. (A,B) The test setup: the photonic chip (PIC) is placed on a circuit board (green), and the electronic chip (EIC) is bonded on top of the photonic chip. (C) ...

Bernin (France), June 3, 2025 – Soitec (Euronext – Tech Leaders), a world leader in the design and production of innovative semiconductor materials, today announced a strategic collaboration with ...

In a few weeks, Intel will release Ivy Bridge, the first mass-produced 22nm parts, and more importantly the first to use 3D "tri-gate" FinFET transistors. These CPUs will be incredibly fast and use ...

Turn photos into 3D with Meta's SAM 3D, using SAM 2 masks and Gaussian splatting, so you can build assets quickly for ...

3D TSV stacking technology is expected to account for the largest share of the 3D stacking market during the forecast period TSV technology is instrumental in the development of 3D stacking DRAMs, ...