From the Robert Mehrabian College of Engineering News article "Galan Moody, 4 Co-PIs Secure $1.15 Million for Advanced 3D Printing” A new age of 3D printing is here, even though ...
Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically speeding up how data moves inside the chip. Unlike traditional flat designs, ...
Early-stage disease diagnosis relies on the highly sensitive detection of biomarkers. Optical whispering-gallery-mode (WGM) microcavity sensors have emerged as a highly promising technology for ...
Tech Xplore on MSN
3D silicon circuits bring denser computer chips closer to reality
By stacking transistors on top of one another, rather than laying them side by side on a flat chip, many electronic engineers ...
Faculty in the Cockrell School of Engineering have developed a rare printer as part of a larger project to speed up production and lower costs of manufacturing semiconductors critical to modern ...
A new chip-based quantum memory uses nanoprinted “light cages” to trap light inside atomic vapor, enabling fast, reliable storage of quantum information. The structures can be fabricated with extreme ...
Dense array of rough copper pillars on a copper plate. A new 3D-printed cold plate used for liquid-cooling high-power computer chips consists of an array of computationally designed, bumpy copper ...
Funding from the U.S. National Science Foundation is part of a broader push to propel domestic computer chip manufacturing A $3 million grant from the U.S. National Science Foundation (NSF) to the ...
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